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| Artikelnummer: | APA503-00-002 |
|---|---|
| Hersteller / Marke: | Artesyn Embedded Power |
| Teil der Beschreibung.: | STUD MTG SOLDER FOR HEATSINK |
| Datenblätte: |
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| RoHs Status: | Lead free / RoHs compliant |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Serie | AMPSS® |
| Zum Gebrauch mit / Verwandte Produkte | AMPSS® |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Zubehör-Typ | Mounting Kit |




STUD MTG TAPPED FOR HEATSINK LP
STUD MTG SOLDER FOR HEATSINK LP
STUD MTG TAPPED FOR HEATSINK
IC FPGA 356 I/O 456BGA
SOCKET SPRING(20-CONTROL/15-PWR)
HEATSINK (80) 115X59X22.5MM HORZ
PAD THERMAL SIZE60 FOR AMPSS MOD
IC FPGA 356 I/O 456BGA
PAD THERMAL SIZE80 FOR AMPSS MOD
IC FPGA 356 I/O 456BGA
HEATSINK (80) 115X59X37MM HORZ
ANPEC SOP8
HEATSINK (80) 115X59X15MM HORZ
HEATSINK (80) 115X59X15MM VERT
HEATSINK (80) 115X59X37MM VERT
IC FPGA 356 I/O 456BGA
IC FPGA 356 I/O 456BGA
HEATSINK (80) 115X59X22.5MM VERT
IC FPGA 356 I/O 456BGA
HEATSINK (80)115.6X89X12MM LOPRO
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APA503-00-002Artesyn Embedded Power |
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