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| Artikelnummer: | APA501-80-007 |
|---|---|
| Hersteller / Marke: | Artesyn Embedded Power |
| Teil der Beschreibung.: | HEATSINK (80)115.6X89X12MM LOPRO |
| Datenblätte: |
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| RoHs Status: | Lead free / RoHs compliant |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
| Anzahl | Einzelpreis |
|---|---|
| 50+ | $14.1839 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Serie | - |
| Paket | Tray |
| Zum Gebrauch mit / Verwandte Produkte | AMPSS® |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Grundproduktnummer | APA501 |
| Zubehör-Typ | Heat Sink |




PAD THERMAL SIZE80 FOR AMPSS MOD
HEATSINK (80) 115X59X15MM HORZ
STUD MTG TAPPED FOR HEATSINK LP
HEATSINK (80) 115X59X22.5MM HORZ
HEATSINK (80) 115X59X37MM HORZ
SOCKET SPRING(20-CONTROL/15-PWR)
PAD THERMAL SIZE60 FOR AMPSS MOD
HEATSINK (80) 115X59X15MM VERT
STUD MTG SOLDER FOR HEATSINK LP
ANPEC SOP8
HEATSINK (60) 57.5X59X37MM VERT
IC FPGA 356 I/O 456BGA
HEATSINK (60)57.2X89X12MM LO PRO
HEATSINK (60) 57.5X59X37MM HORZ
HEATSINK (80) 115X59X37MM VERT
HEATSINK (80) 115X59X22.5MM VERT
STUD MTG SOLDER FOR HEATSINK
HEATSINK (60)57.5X59X22.5MM HORZ
STUD MTG TAPPED FOR HEATSINK
IC FPGA 356 I/O 456BGA
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APA501-80-007Artesyn Embedded Power |
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