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| Artikelnummer: | BCM55030SE01 |
|---|---|
| Hersteller / Marke: | Avago Technologies (Broadcom) |
| Teil der Beschreibung.: | 55030+3384 BUNDLE |
| Datenblätte: |
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| RoHs Status: | |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Serie | * |
| Paket | Tray |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Grundproduktnummer | BCM55030 |




IC TXRX PHY 17X17 QUAD 5G MAC HS
BROADCO BGA
BROADCO BGA
XFI/USXGMII 2.5G PHY W/HEAT SPRD
BROADCOM BGA
BROADCOM BGA
IC TK3715A EPON ONU TFBGA W/FE
1P GPON/10G DPU TO G.FAST 212 B1
BROADCOM BGA
10 G EPON SFU FOR CABLE MARKET
10G XPON DPU CHIP
IC,TK3715A EPON ONU TFBGA W/FEC
10G XPON MDU CHIP
1P GPON DPU TO G.FAST 212
BCM55030 + BCM54640
BROADCOM BGA
10G EPON MDU
10G XPON BRIDGE CHIP
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BCM55030SE01Broadcom Limited |
Anzahl*
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Zielpreis (USD)
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