Deutsch
| Artikelnummer: | SOFT E1 KIT |
|---|---|
| Hersteller / Marke: | TDK Corporation |
| Teil der Beschreibung.: | CAP KIT CER 0.01UF-10UF 180PCS |
| Datenblätte: |
|
| RoHs Status: | |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
| Anzahl | Einzelpreis |
|---|---|
| 1+ | $85.2146 |
| 10+ | $73.9719 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Spannung - Nennwert | 25 ~ 630V |
| Toleranz | ±20% |
| Serie | C |
| Menge | 180 Pieces (18 Values - 10 Each) |
| Enthaltene Pakete | 0805 ~ 2220 (2012 ~ 5750 Metric) |
| Paket | Book |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Befestigungsart | Surface Mount, MLCC |
| Kit-Typ | Ceramic |
| Eigenschaften | Soft Termination |
| Kapazitätsbereich | 0.01µF ~ 10µF |
| Anwendungen | Boardflex Sensitive |




THERM PAD 76.2X76.2MM W/ADH
THERM PAD 400X200MM W/ADH
FOOT CYLINDRICAL 0.626" DIA BLK
7" High Bright IPS Raspberry Pi
THERM PAD 400X200MM W/ADH
FOOT CYLINDRICAL 0.72" DIA BLACK
AMIS SOP28
FOOT CYLINDRICAL 0.75" DIA BLACK
THERM PAD 76.2X76.2MM W/ADH
AMIS SOP16
THERM PAD 76.2X76.2MM W/ADH
THERM PAD 400X200MM W/ADH
THERM PAD 76.2X76.2MM W/ADH
THERM PAD 400X200MM W/ADH
FOOT CYLINDRICAL 0.689" DIA BLK
FOOT CYLINDRICAL 0.886" DIA BLK
THERM PAD 400X200MM W/ADH
THERM PAD 76.2X76.2MM W/ADH
2026/03/31
2026/03/23
2026/03/20
2026/03/9
2026/03/4
2026/02/28
2026/02/3
2026/01/28
2026/01/19
2026/01/16
2026/01/9
2025/12/29
2025/12/25
2025/12/17
2025/12/10
2025/12/4
2025/11/25
2025/11/20
2025/11/11
2025/11/3
2025/10/30
2025/10/22
2025/10/16
2025/10/9
2025/09/28
2025/09/17
2025/09/9
2025/09/1
2025/08/25
2025/08/20
2025/07/3
2024/12/18
2023/06/21
2023/04/27
2022/07/1
2021/03/4
2020/09/10
2020/01/23
0 Artikel
2025/02/11
2025/02/10
2024/10/30
2025/02/23
SOFT E1 KITTDK Corporation |
Anzahl*
|
Zielpreis (USD)
|