Deutsch

| Artikelnummer: | BU7966GUW-E2 |
|---|---|
| Hersteller / Marke: | LAPIS Technology |
| Teil der Beschreibung.: | IC INTFACE SPECIALIZED 63VBGA |
| Datenblätte: |
|
| RoHs Status: | |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Spannungsversorgung | 1.65V ~ 1.95V |
| Supplier Device-Gehäuse | VBGA063W050 |
| Serie | - |
| Verpackung / Gehäuse | 63-VFBGA |
| Paket | Tape & Reel (TR) |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Befestigungsart | Surface Mount |
| Schnittstelle | Serial |
| Grundproduktnummer | BU7966 |
| Anwendungen | Cell Phone |
| BU7966GUW-E2 Einzelheiten PDF [English] | BU7966GUW-E2 PDF - EN.pdf |




BU7876GLS-GE2 ROHM
BU7964GUW ROHM
IC DESERIALIZER LVDS 100TQFP
ROHM TSOP-6
IC INTFACE SPECIALIZED 63VBGA
ROHM BGA
ROHM BGA/5*5
IC DATA FORMATTER LSI
BU7879KVT-E2 ROHM
BU7967GUW-SE2 Original
ROHM QFN
IC DESERIALIZER LVDS 100TQFP
ROHM BGA
IC INTFACE SPECIALIZED 63VBGA
SUCCESSIVE APPROXIMATION A/D CON
IC DESERIALIZER LVDS 100TQFP
BU7962GVM-E2 ROHM
IC INTFACE SPECIALIZED 63VBGA
IC TRANSCEIVER FULL VBGA063W050
2026/03/31
2026/03/23
2026/03/20
2026/03/9
2026/03/4
2026/02/28
2026/02/3
2026/01/28
2026/01/19
2026/01/16
2026/01/9
2025/12/29
2025/12/25
2025/12/17
2025/12/10
2025/12/4
2025/11/25
2025/11/20
2025/11/11
2025/11/3
2025/10/30
2025/10/22
2025/10/16
2025/10/9
2025/09/28
2025/09/17
2025/09/9
2025/09/1
2025/08/25
2025/08/20
2025/07/3
2024/12/18
2023/06/21
2023/04/27
2022/07/1
2021/03/4
2020/09/10
2020/01/23
0 Artikel






2025/02/16
2024/05/16
2024/12/4
2025/01/26
BU7966GUW-E2Rohm Semiconductor |
Anzahl*
|
Zielpreis (USD)
|