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| Artikelnummer: | ZSSC3170EE1C |
|---|---|
| Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
| Teil der Beschreibung.: | DICE (WAFER SAWN) - FRAME |
| Datenblätte: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Zahlungsmittel: | PayPal / Credit Card / T/T |
| Versandweg: | DHL / Fedex / TNT / UPS / EMS |
| Aktie: |
Ship From: Hong Kong
| Anzahl | Einzelpreis |
|---|---|
| 1+ | $4.7127 |
| 200+ | $1.8245 |
| 500+ | $1.7606 |
| 1000+ | $1.7286 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
| Produkteigenschaften | Eigenschaften |
|---|---|
| Serie | * |
| Paket | Tray |
| Produkteigenschaften | Eigenschaften |
|---|---|
| Grundproduktnummer | ZSSC3170 |




IC INTFACE SPECIALIZED 32VFQFPN
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
IC INTFACE SPECIALIZED SGNL COND
DICE (WAFER SAWN) - WAFFLE PACK
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
DICE (WAFER SAWN) - FRAME
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - FRAME
IC INTERFACE
IC INTFACE SPECIALIZED 32VFQFPN
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTERFACE
WAFER (UNSAWN) - BOX
IC INTFACE SPECIALIZED SGNL COND
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ZSSC3170EE1CIDT, Integrated Device Technology Inc |
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Zielpreis (USD)
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